TY  - JOUR
A1  - Wernicki, E 
A1  - Fratto, E 
A1  - Shu, Y 
A1  - Gao, F 
A1  - Gu, Z 
T1  - Micro-scale solder joints between Cu-Cu wires formed by nanoparticle enabled lead-free solder pastes.
Y1  - 2016/05/
N1  - SU835938
JF  - IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
SP  - 1203
EP  - 1208
ER  -